Yin, Y.; Yang, J.; Li, H.; Yang, W.; Li, Y.; Li, H.
Design of High-Speed Thin-Film Lithium Niobate Modulator Utilizing Flip-Chip Bonding with Bump Contacts. Electronics 2024, 13, 4463.
https://doi.org/10.3390/electronics13224463
AMA Style
Yin Y, Yang J, Li H, Yang W, Li Y, Li H.
Design of High-Speed Thin-Film Lithium Niobate Modulator Utilizing Flip-Chip Bonding with Bump Contacts. Electronics. 2024; 13(22):4463.
https://doi.org/10.3390/electronics13224463
Chicago/Turabian Style
Yin, Yihui, Jiayu Yang, Haiou Li, Wanli Yang, Yue Li, and Hanyu Li.
2024. "Design of High-Speed Thin-Film Lithium Niobate Modulator Utilizing Flip-Chip Bonding with Bump Contacts" Electronics 13, no. 22: 4463.
https://doi.org/10.3390/electronics13224463
APA Style
Yin, Y., Yang, J., Li, H., Yang, W., Li, Y., & Li, H.
(2024). Design of High-Speed Thin-Film Lithium Niobate Modulator Utilizing Flip-Chip Bonding with Bump Contacts. Electronics, 13(22), 4463.
https://doi.org/10.3390/electronics13224463