Next Article in Journal
Naturalistic Driving Data-Based Anomalous Driving Behavior Detection Using Hypertuned Deep Autoencoders
Next Article in Special Issue
Challenges: ESD Protection for Heterogeneously Integrated SoICs in Advanced Packaging
Previous Article in Journal
Nonlinear Modeling and Transmission Efficiency Optimization of MCR-WPT System Based on Monte Carlo-Interior Point Method
Previous Article in Special Issue
Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints
 
 

Order Article Reprints

Journal: Electronics, 2023
Volume: 12
Number: 2073

Article: Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP
Authors: by Wei Li and Daquan Yu
Link: https://www.mdpi.com/2079-9292/12/9/2073

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Quote and Order Details

Contact Person

Invoice Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop