Article Versions Notes

Jin L, Tang Z, Chen L, Xie G, Chen Z, Wei W, Fan J, Gong X, Zhang M. Sidewall Modification Process for Trench Silicon Power Devices. Electronics. 2023; 12(11):2385. https://doi.org/10.3390/electronics12112385

Jin, Lei, Zhuorui Tang, Long Chen, Guijiu Xie, Zhanglong Chen, Wei Wei, Jianghua Fan, Xiaoliang Gong, and Ming Zhang. 2023. "Sidewall Modification Process for Trench Silicon Power Devices" Electronics 12, no. 11: 2385. https://doi.org/10.3390/electronics12112385

Jin, L., Tang, Z., Chen, L., Xie, G., Chen, Z., Wei, W., Fan, J., Gong, X., & Zhang, M. (2023). Sidewall Modification Process for Trench Silicon Power Devices. Electronics, 12(11), 2385. https://doi.org/10.3390/electronics12112385