Order Article Reprints
Journal: Electronics, 2022
Volume: 11
Number: 1373
Article:
Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters
Authors:
by
Md. Nazmul Hasan, Timothy Polom, Dominik Holzmann, Perla Malagó, Alfred Binder and Ali Roshanghias
Link:
https://www.mdpi.com/2079-9292/11/9/1373
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.