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Journal: Electronics, 2022
Volume: 11
Number: 1373

Article: Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters
Authors: by Md. Nazmul Hasan, Timothy Polom, Dominik Holzmann, Perla Malagó, Alfred Binder and Ali Roshanghias
Link: https://www.mdpi.com/2079-9292/11/9/1373

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