Order Article Reprints

Luo D, Chen M, Lai W, Xia H, Deng Z, Wang Z, Yu K. A Fault Detection Method of IGBT Bond Wire Fatigue Based on the Reduction of Measured Heatsink Thermal Resistance. Electronics. 2022; 11(7):1021. https://doi.org/10.3390/electronics11071021

Luo, Dan, Minyou Chen, Wei Lai, Hongjian Xia, Zhenyu Deng, Zhi Wang, and Kai Yu. 2022. "A Fault Detection Method of IGBT Bond Wire Fatigue Based on the Reduction of Measured Heatsink Thermal Resistance" Electronics 11, no. 7: 1021. https://doi.org/10.3390/electronics11071021

Luo, D., Chen, M., Lai, W., Xia, H., Deng, Z., Wang, Z., & Yu, K. (2022). A Fault Detection Method of IGBT Bond Wire Fatigue Based on the Reduction of Measured Heatsink Thermal Resistance. Electronics, 11(7), 1021. https://doi.org/10.3390/electronics11071021