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Journal: Electronics, 2022
Volume: 11
Number: 236
Article:
Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)
Authors:
by
Takayuki Ohba, Koji Sakui, Shinji Sugatani, Hiroyuki Ryoson and Norio Chujo
Link:
https://www.mdpi.com/2079-9292/11/2/236
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