Next Article in Journal
Tensor-Based Recursive Least-Squares Adaptive Algorithms with Low-Complexity and High Robustness Features
Next Article in Special Issue
High-Density Solid-State Memory Devices and Technologies
Previous Article in Journal
Construction and Analysis of Integral User-Oriented Trustworthiness Metrics
Previous Article in Special Issue
Recent Progress on 3D NAND Flash Technologies
 
 

Order Article Reprints

Journal: Electronics, 2022
Volume: 11
Number: 236

Article: Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)
Authors: by Takayuki Ohba, Koji Sakui, Shinji Sugatani, Hiroyuki Ryoson and Norio Chujo
Link: https://www.mdpi.com/2079-9292/11/2/236

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Quote and Order Details

Contact Person

Invoice Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop