Next Article in Journal
Research on Fingerprint and Hyperbolic Fusion Positioning Algorithm Based on 5G Technology
Next Article in Special Issue
Blockchain for Food Tracking
Previous Article in Journal
Recent Progress in Fabrication and Physical Properties of 2D TMDC-Based Multilayered Vertical Heterostructures
Previous Article in Special Issue
A Peer-to-Peer Smart Food Delivery Platform Based on Smart Contract
 
 
Article

Article Versions Notes

Electronics 2022, 11(15), 2403; https://doi.org/10.3390/electronics11152403
Action Date Notes Link
article pdf uploaded. 1 August 2022 13:03 CEST Version of Record https://www.mdpi.com/2079-9292/11/15/2403/pdf-vor
article xml file uploaded 9 August 2022 11:14 CEST Original file -
article xml uploaded. 9 August 2022 11:14 CEST Update https://www.mdpi.com/2079-9292/11/15/2403/xml
article pdf uploaded. 9 August 2022 11:14 CEST Updated version of record https://www.mdpi.com/2079-9292/11/15/2403/pdf
article html file updated 9 August 2022 11:16 CEST Original file -
article html file updated 10 August 2022 10:03 CEST Update -
article html file updated 13 August 2022 05:02 CEST Update https://www.mdpi.com/2079-9292/11/15/2403/html
Back to TopTop