Order Article Reprints

Yan L, Yao J, Dai Y, Zhang S, Bai W, Gao K, Yang H, Wang Y. Study of Thermal Stress Fluctuations at the Die-Attach Solder Interface Using the Finite Element Method. Electronics. 2022; 11(1):62. https://doi.org/10.3390/electronics11010062

Yan, Luchun, Jiawen Yao, Yu Dai, Shanshan Zhang, Wangmin Bai, Kewei Gao, Huisheng Yang, and Yanbin Wang. 2022. "Study of Thermal Stress Fluctuations at the Die-Attach Solder Interface Using the Finite Element Method" Electronics 11, no. 1: 62. https://doi.org/10.3390/electronics11010062

Yan, L., Yao, J., Dai, Y., Zhang, S., Bai, W., Gao, K., Yang, H., & Wang, Y. (2022). Study of Thermal Stress Fluctuations at the Die-Attach Solder Interface Using the Finite Element Method. Electronics, 11(1), 62. https://doi.org/10.3390/electronics11010062