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Journal: Electronics, 2021
Volume: 10
Number: 2785
Article:
Machine Learning (ML) Based Thermal Management for Cooling of Electronics Chips by Utilizing Thermal Energy Storage (TES) in Packaging That Leverages Phase Change Materials (PCM)
Authors:
by
Aditya Chuttar and Debjyoti Banerjee
Link:
https://www.mdpi.com/2079-9292/10/22/2785
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