Liu, X.; Sun, Q.; Huang, Y.; Chen, Z.; Liu, G.; Zhang, D.W.
Optimization of TSV Leakage in Via-Middle TSV Process for Wafer-Level Packaging. Electronics 2021, 10, 2370.
https://doi.org/10.3390/electronics10192370
AMA Style
Liu X, Sun Q, Huang Y, Chen Z, Liu G, Zhang DW.
Optimization of TSV Leakage in Via-Middle TSV Process for Wafer-Level Packaging. Electronics. 2021; 10(19):2370.
https://doi.org/10.3390/electronics10192370
Chicago/Turabian Style
Liu, Xuanjie, Qingqing Sun, Yiping Huang, Zheng Chen, Guoan Liu, and David Wei Zhang.
2021. "Optimization of TSV Leakage in Via-Middle TSV Process for Wafer-Level Packaging" Electronics 10, no. 19: 2370.
https://doi.org/10.3390/electronics10192370
APA Style
Liu, X., Sun, Q., Huang, Y., Chen, Z., Liu, G., & Zhang, D. W.
(2021). Optimization of TSV Leakage in Via-Middle TSV Process for Wafer-Level Packaging. Electronics, 10(19), 2370.
https://doi.org/10.3390/electronics10192370