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Antenna on Chip (AoC) Design Using Metasurface and SIW Technologies for THz Wireless Applications
Article

Compact and Low-Profile On-Chip Antenna Using Underside Electromagnetic Coupling Mechanism for Terahertz Front-End Transceivers

1
Electronic Engineering Department, University of Rome “Tor Vergata”, Via del Politecnico 1, 00133 Rome, Italy
2
Center for Communications Technology & Mathematics, School of Computing & Digital Media, London Metropolitan University, London N7 8DB, UK
3
Department of Electrical Engineering, Jouf University, Sakaka 72388, Saudi Arabia
*
Authors to whom correspondence should be addressed.
Academic Editor: Christian Pilato
Electronics 2021, 10(11), 1264; https://doi.org/10.3390/electronics10111264
Received: 17 April 2021 / Revised: 16 May 2021 / Accepted: 24 May 2021 / Published: 25 May 2021
(This article belongs to the Special Issue Advances in System-on-Chip Design)
The results presented in this paper show that by employing a combination of metasurface and substrate integrated waveguide (SIW) technologies, we can realize a compact and low-profile antenna that overcomes the drawbacks of narrow-bandwidth and low-radiation properties encountered by terahertz antennas on-chip (AoC). In addition, an effective RF cross-shaped feed structure is used to excite the antenna from its underside by coupling, electromagnetically, RF energy through the multi-layered antenna structure. The feed mechanism facilitates integration with the integrated circuits. The proposed antenna is constructed from five stacked layers, comprising metal–silicon–metal–silicon–metal. The dimensions of the AoC are 1 × 1 × 0.265 mm3. The AoC is shown to have an impedance match, radiation gain and efficiency of ≤ −15 dB, 8.5 dBi and 67.5%, respectively, over a frequency range of 0.20–0.22 THz. The results show that the proposed AoC design is viable for terahertz front-end applications. View Full-Text
Keywords: antenna on-chip (AoC); metasurface; substrate integrated waveguide (SIW); terahertz (THz); electromagnetic (EM) coupling; feeding mechanism; RF front-end antenna on-chip (AoC); metasurface; substrate integrated waveguide (SIW); terahertz (THz); electromagnetic (EM) coupling; feeding mechanism; RF front-end
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MDPI and ACS Style

Alibakhshikenari, M.; Virdee, B.S.; Althuwayb, A.A.; Mariyanayagam, D.; Limiti, E. Compact and Low-Profile On-Chip Antenna Using Underside Electromagnetic Coupling Mechanism for Terahertz Front-End Transceivers. Electronics 2021, 10, 1264. https://doi.org/10.3390/electronics10111264

AMA Style

Alibakhshikenari M, Virdee BS, Althuwayb AA, Mariyanayagam D, Limiti E. Compact and Low-Profile On-Chip Antenna Using Underside Electromagnetic Coupling Mechanism for Terahertz Front-End Transceivers. Electronics. 2021; 10(11):1264. https://doi.org/10.3390/electronics10111264

Chicago/Turabian Style

Alibakhshikenari, Mohammad, Bal S. Virdee, Ayman A. Althuwayb, Dion Mariyanayagam, and Ernesto Limiti. 2021. "Compact and Low-Profile On-Chip Antenna Using Underside Electromagnetic Coupling Mechanism for Terahertz Front-End Transceivers" Electronics 10, no. 11: 1264. https://doi.org/10.3390/electronics10111264

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