Bae, S.H.; Kim, S.; Yi, S.H.; Son, I.; Kim, K.T.; Chung, H.
Effect of Surface Roughness and Electroless Ni–P Plating on the Bonding Strength of Bi–Te-based Thermoelectric Modules. Coatings 2019, 9, 213.
https://doi.org/10.3390/coatings9030213
AMA Style
Bae SH, Kim S, Yi SH, Son I, Kim KT, Chung H.
Effect of Surface Roughness and Electroless Ni–P Plating on the Bonding Strength of Bi–Te-based Thermoelectric Modules. Coatings. 2019; 9(3):213.
https://doi.org/10.3390/coatings9030213
Chicago/Turabian Style
Bae, Sung Hwa, Sungsoon Kim, Seong Hoon Yi, Injoon Son, Kyung Tae Kim, and Hoyong Chung.
2019. "Effect of Surface Roughness and Electroless Ni–P Plating on the Bonding Strength of Bi–Te-based Thermoelectric Modules" Coatings 9, no. 3: 213.
https://doi.org/10.3390/coatings9030213
APA Style
Bae, S. H., Kim, S., Yi, S. H., Son, I., Kim, K. T., & Chung, H.
(2019). Effect of Surface Roughness and Electroless Ni–P Plating on the Bonding Strength of Bi–Te-based Thermoelectric Modules. Coatings, 9(3), 213.
https://doi.org/10.3390/coatings9030213