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Coatings 2018, 8(8), 289; https://doi.org/10.3390/coatings8080289

Magnetron Sputtered AlN Layers on LTCC Multilayer and Silicon Substrates

1
Institute for Micro- and Nanotechnologies MacroNano®, Technische Universität Ilmenau, Gustav-Kirchhoff-Str. 7, 98693 Ilmenau, Germany
2
Physics Department, Pontificia Universidad Católica del Perú, San Miguel, Lima 15088, Peru
3
IMEYMAT Institute of Research on Electron Microscopy and Materials, Universidad de Cádiz, 11002 Cádiz, Spain
4
Department of Condensed Matter Physics, Facultad de Ciencias, Universidad de Cádiz, 11510 Puerto Real, Spain
*
Author to whom correspondence should be addressed.
Received: 20 June 2018 / Revised: 18 July 2018 / Accepted: 25 July 2018 / Published: 18 August 2018
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Abstract

This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilayer ceramic substrates. The variation of sputter parameters in a wide range following a fractional factorial experimental design generates diverse crystallographic properties of the layers. Crystal growth, composition, and stress are distinguished because of substrate morphology and thermal conditions. The best c-axis orientation of aluminum nitride emerges on ceramic substrates at a heater temperature of 150 °C and sputter power of 400 W. Layers deposited on ceramic show stronger c-axis texture than those deposited on silicon due to higher surface temperature. The nucleation differs significantly dependent on the substrate. It is demonstrated that a ceramic substrate material with an adapted coefficient of thermal expansion to aluminum nitride allows reducing the layer stress considerably, independent on process temperature. Layers sputtered on silicon partly peeled off, while they adhere well on ceramic without crack formation. Direct deposition on ceramic enables thus the development of optimized layers, avoiding restrictions by stress compensating needs affecting functional properties. View Full-Text
Keywords: low temperature cofired ceramics; LTCC; aluminum nitride; high-rate magnetron sputtering; stress reduction; substrate influence on nucleation; cubic aluminum nitride low temperature cofired ceramics; LTCC; aluminum nitride; high-rate magnetron sputtering; stress reduction; substrate influence on nucleation; cubic aluminum nitride
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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Bartsch, H.; Grieseler, R.; Mánuel, J.; Pezoldt, J.; Müller, J. Magnetron Sputtered AlN Layers on LTCC Multilayer and Silicon Substrates. Coatings 2018, 8, 289.

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