Thermal Stress Evolution and Microstructural Development in Simulated Lunar Regolith During Microwave Sintering and Cooling
Abstract
1. Introduction
2. Materials and Methods
2.1. Material and Preparation
2.2. Microwave Sintering Procedure
2.3. Cooling Process
2.4. Characterization
3. Results and Discussion
3.1. Model Formulation
3.2. Simulation of the Cooling Process
3.3. Stress Evolution During Cooling
3.4. Microstructural Changes
4. Conclusions
- The cooling rate is a key factor controlling the surface integrity of sintered bodies. Research indicates that when the cooling rate is below 15 °C/min, the surface thermal stress remains below the material’s tensile strength threshold, effectively preventing crack formation. When the cooling rate exceeds 16 °C/min, the surface thermal stress surpasses this threshold, leading to crack initiation and propagation.
- Under rapid cooling conditions, a silicate glass phase forms on the surface. Cracks preferentially initiate in regions with lower Si/Al content and the presence of C impurities, propagating due to thermo-elastic mismatch.
- XRD and XPS analysis results show that during sintering, the olivine phase undergoes oxidative decomposition, forming new phases such as magnetite (Fe3O4) and hematite (Fe2O3). The surface chemical state is dominated by non-bridging oxygen (NBO), which exacerbates thermal stress and contributes to crack formation.
- A safe cooling rate of 15 °C/min is identified, ensuring the surface integrity required for microwave sintering.
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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| Oxide | Mass Fraction/wt.% |
|---|---|
| SiO2 | 44.48 |
| Fe2O3 | 24.64 |
| Al2O3 | 12.53 |
| CaO | 10.6 |
| TiO2 | 4.27 |
| K2O | 2.69 |
| MnO | 0.36 |
| SrO | 0.24 |
| ZrO2 | 0.08 |
| Cr2O3 | 0.06 |
| ZnO | 0.04 |
| Total | 99.99 |
| Paramaeters | Lunar Regolith Simulant | SiC | Insulating Fiber |
|---|---|---|---|
| Density (kg/m3) | 2560 | 3120 | 275 |
| Thermal conductivity (W/(m⋅K) | 1.29 | 170 | 0.125 |
| Specific heat (J/(kg⋅K)) | 790 | 625 | 925 |
| Relative permeability | 0.9801 | 1.01 | 1 |
| Relative permittivity | 3.0419 | 10 | - |
| Loss tangent | 0.05 | 0.5 | - |
| Electrical conductivity (S/m) | 1 × 10−6 | 10 | - |
| Surface emissivity | 0.85 | 0.85 | 0.8 |
| Young’s modulus (Gpa) | 100 | - | - |
| Poisson’s ratio | 0.24 | - | - |
| Element | Spot 1 (at.%) | Spot 2 (at.%) |
|---|---|---|
| O | 65.31 | 67.85 |
| Na | 2.3 | 2.84 |
| Mg | 2.21 | 2.36 |
| Al | 4.89 | 6.83 |
| Si | 10.78 | 15.15 |
| Fe | 0.39 | 2.06 |
| C | 12.08 | - |
| Ti | - | 0.71 |
| Total | 97.76 | 97.80 |
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Xi, Z.; Wei, Q.; Liu, Y. Thermal Stress Evolution and Microstructural Development in Simulated Lunar Regolith During Microwave Sintering and Cooling. Coatings 2026, 16, 222. https://doi.org/10.3390/coatings16020222
Xi Z, Wei Q, Liu Y. Thermal Stress Evolution and Microstructural Development in Simulated Lunar Regolith During Microwave Sintering and Cooling. Coatings. 2026; 16(2):222. https://doi.org/10.3390/coatings16020222
Chicago/Turabian StyleXi, Zhenhua, Qiang Wei, and Yuming Liu. 2026. "Thermal Stress Evolution and Microstructural Development in Simulated Lunar Regolith During Microwave Sintering and Cooling" Coatings 16, no. 2: 222. https://doi.org/10.3390/coatings16020222
APA StyleXi, Z., Wei, Q., & Liu, Y. (2026). Thermal Stress Evolution and Microstructural Development in Simulated Lunar Regolith During Microwave Sintering and Cooling. Coatings, 16(2), 222. https://doi.org/10.3390/coatings16020222

