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Journal: Coatings, 2022
Volume: 12
Number: 613
613
Article: Self-Formed Diffusion Layer in Cu(Re) Alloy Film for Barrierless Copper Metallization
Authors: by Bin Cheng, Hongmei Chen, Isaac Asempah, Jiheng Wang, Yilin Zhu, Jun Wan, Feiran Jiang, Ze Wang, Yang Shui, Lei Wang, Lei Jin and Yanxin Qiao
Link: https://www.mdpi.com/2079-6412/12/5/613

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