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Journal: Coatings, 2020
Volume: 10
Number: 155

Article: Electrical and Reliability Characteristics of Self-Forming Barrier for CuNd/SiOCH Films in Cu Interconnects
Authors: by Yi-Lung Cheng, Chih-Yen Lee, Wei-Fan Peng, Giin-Shan Chen and Jau-Shiung Fang
Link: https://www.mdpi.com/2079-6412/10/2/155

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