Żukowski, P.; Bondariev, V.; Kupchishin, A.I.; Niyazov, M.N.; Tlebaev, K.B.; Bobitski, Y.; Kisała, J.; Wojtas, J.; Żaczek, A.; Hardoň, Š.;
et al. Reactive Magnetron-Sputtered Tantalum–Copper Nitride Coatings: Structure, Electrical Anisotropy, and Antibacterial Behavior. Nanomaterials 2025, 15, 1813.
https://doi.org/10.3390/nano15231813
AMA Style
Żukowski P, Bondariev V, Kupchishin AI, Niyazov MN, Tlebaev KB, Bobitski Y, Kisała J, Wojtas J, Żaczek A, Hardoň Š,
et al. Reactive Magnetron-Sputtered Tantalum–Copper Nitride Coatings: Structure, Electrical Anisotropy, and Antibacterial Behavior. Nanomaterials. 2025; 15(23):1813.
https://doi.org/10.3390/nano15231813
Chicago/Turabian Style
Żukowski, Paweł, Vitalii Bondariev, Anatoliy I. Kupchishin, Marat N. Niyazov, Kairat B. Tlebaev, Yaroslav Bobitski, Joanna Kisała, Joanna Wojtas, Anna Żaczek, Štefan Hardoň,
and et al. 2025. "Reactive Magnetron-Sputtered Tantalum–Copper Nitride Coatings: Structure, Electrical Anisotropy, and Antibacterial Behavior" Nanomaterials 15, no. 23: 1813.
https://doi.org/10.3390/nano15231813
APA Style
Żukowski, P., Bondariev, V., Kupchishin, A. I., Niyazov, M. N., Tlebaev, K. B., Bobitski, Y., Kisała, J., Wojtas, J., Żaczek, A., Hardoň, Š., & Pogrebnjak, A. D.
(2025). Reactive Magnetron-Sputtered Tantalum–Copper Nitride Coatings: Structure, Electrical Anisotropy, and Antibacterial Behavior. Nanomaterials, 15(23), 1813.
https://doi.org/10.3390/nano15231813