Saleh, A.S.; Croes, K.; Ceric, H.; De Wolf, I.; Zahedmanesh, H.
A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects. Nanomaterials 2024, 14, 1834.
https://doi.org/10.3390/nano14221834
AMA Style
Saleh AS, Croes K, Ceric H, De Wolf I, Zahedmanesh H.
A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects. Nanomaterials. 2024; 14(22):1834.
https://doi.org/10.3390/nano14221834
Chicago/Turabian Style
Saleh, Ahmed Sobhi, Kristof Croes, Hajdin Ceric, Ingrid De Wolf, and Houman Zahedmanesh.
2024. "A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects" Nanomaterials 14, no. 22: 1834.
https://doi.org/10.3390/nano14221834
APA Style
Saleh, A. S., Croes, K., Ceric, H., De Wolf, I., & Zahedmanesh, H.
(2024). A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects. Nanomaterials, 14(22), 1834.
https://doi.org/10.3390/nano14221834