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Journal: Nanomaterials, 2024
Volume: 14
Number: 861

Article: Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces
Authors: by Tsan-Feng Lu, Yu-Ting Yen, Pei-Wen Wang, Yuan-Fu Cheng, Cheng-Hsiang Chen and YewChung Sermon Wu
Link: https://www.mdpi.com/2079-4991/14/10/861

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