Article Versions Notes

Hsu W-Y, Yang S-C, Lin Y-Y, Hsieh W-Z, Tu K-N, Chiu W-L, Chang H-H, Chiang C-Y, Chen C. Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO₂ Hybrid Joints. Nanomaterials. 2023; 13(17):2448. https://doi.org/10.3390/nano13172448

Hsu, Wei-You, Shih-Chi Yang, You-Yi Lin, Wan-Zhen Hsieh, King-Ning Tu, Wei-Lan Chiu, Hsiang-Hung Chang, Ching-Yu Chiang, and Chih Chen. 2023. "Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO₂ Hybrid Joints" Nanomaterials 13, no. 17: 2448. https://doi.org/10.3390/nano13172448

Hsu, W.-Y., Yang, S.-C., Lin, Y.-Y., Hsieh, W.-Z., Tu, K.-N., Chiu, W.-L., Chang, H.-H., Chiang, C.-Y., & Chen, C. (2023). Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO₂ Hybrid Joints. Nanomaterials, 13(17), 2448. https://doi.org/10.3390/nano13172448