Pryjmaková, J.; Hryhoruk, M.; Veselý, M.; Slepička, P.; Švorčík, V.; Siegel, J.
Engineered Cu-PEN Composites at the Nanoscale: Preparation and Characterisation. Nanomaterials 2022, 12, 1220.
https://doi.org/10.3390/nano12071220
AMA Style
Pryjmaková J, Hryhoruk M, Veselý M, Slepička P, Švorčík V, Siegel J.
Engineered Cu-PEN Composites at the Nanoscale: Preparation and Characterisation. Nanomaterials. 2022; 12(7):1220.
https://doi.org/10.3390/nano12071220
Chicago/Turabian Style
Pryjmaková, Jana, Mariia Hryhoruk, Martin Veselý, Petr Slepička, Václav Švorčík, and Jakub Siegel.
2022. "Engineered Cu-PEN Composites at the Nanoscale: Preparation and Characterisation" Nanomaterials 12, no. 7: 1220.
https://doi.org/10.3390/nano12071220
APA Style
Pryjmaková, J., Hryhoruk, M., Veselý, M., Slepička, P., Švorčík, V., & Siegel, J.
(2022). Engineered Cu-PEN Composites at the Nanoscale: Preparation and Characterisation. Nanomaterials, 12(7), 1220.
https://doi.org/10.3390/nano12071220