CoSn3 Intermetallic Nanoparticles for Electronic Packaging
Abstract
:1. Introduction
2. Materials and Methods
3. Result and Discussion
3.1. Reductive Reaction
3.2. Growth
3.3. Application of CoSn3 Nanoparticles in Electronic Packaging
4. Conclusions
- (1)
- CoSn3 nanoparticles are successfully prepared via a sodium borohydride reduction method. The precursors used for the preparation of CoSn3 nanoparticles are CoCl2 and SnCl2, and the reducing agent is NaBH4. The reduction products are heated in a tube furnace at 350 °C for 10 min (N2 + H2) to obtain CoSn3 nanoparticles with a size of about 150 nm;
- (2)
- CoSn3 nanoparticles undergo a step reaction in the process of synthesis, as follows: Co3Sn2 -CoSn-CoSn2-CoSn3; AND CoSn3 nanoparticles undergo degradation by heat in the order of CoSn3-CoSn2-CoSn-Co3Sn2, precipitating Sn;
- (3)
- During the growth of CoSn3 nanoparticles by heat, the larger the particle diameter, the faster the growth. In the early stage of nanoparticles growth, the merging of particles of a similar size is the main phenomenon, and the phenomenon of “orientation unification” is found. At the later stage of particle growth, the phenomenon of “orientation adhesion” is found, as the larger particles engulf the smaller ones.
Author Contributions
Funding
Conflicts of Interest
References
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Sodium Borohydride | NaBH4 | AR | Aladdin® |
---|---|---|---|
Cobalt chloride | CoCl2 | AR | Aladdin® |
Stannous chloride | SnCl2·2H2O | AR | Aladdin® |
Triethylene glycol | C6H14O4 | AR | Aladdin® |
Polyethylene glycol | HO(CH2CH2O)nH | AR | Aladdin® |
Ethylene glycol | (CH2OH)2 | AR | Aladdin® |
Polyvinylpyrrolidone | (C6H9NO)n | AR | Aladdin® |
Anhydrous ethanol | C2H6O | AR | Aladdin® |
Dimethyldiallylammonium chloride | C8H16NCl | AR | Aladdin® |
OM338PT SAC305 | Sn-3.0Ag-0.5Cu | ∽90% | ALPHA® |
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Wang, J.; Lv, Z.; Zhang, L.; Duan, F.; Zhang, W.; Chen, H. CoSn3 Intermetallic Nanoparticles for Electronic Packaging. Nanomaterials 2022, 12, 4083. https://doi.org/10.3390/nano12224083
Wang J, Lv Z, Zhang L, Duan F, Zhang W, Chen H. CoSn3 Intermetallic Nanoparticles for Electronic Packaging. Nanomaterials. 2022; 12(22):4083. https://doi.org/10.3390/nano12224083
Chicago/Turabian StyleWang, Jintao, Ziwen Lv, Luobin Zhang, Fangcheng Duan, Weiwei Zhang, and Hongtao Chen. 2022. "CoSn3 Intermetallic Nanoparticles for Electronic Packaging" Nanomaterials 12, no. 22: 4083. https://doi.org/10.3390/nano12224083