Wang, J.; Lv, Z.; Zhang, L.; Duan, F.; Zhang, W.; Chen, H.
CoSn3 Intermetallic Nanoparticles for Electronic Packaging. Nanomaterials 2022, 12, 4083.
https://doi.org/10.3390/nano12224083
AMA Style
Wang J, Lv Z, Zhang L, Duan F, Zhang W, Chen H.
CoSn3 Intermetallic Nanoparticles for Electronic Packaging. Nanomaterials. 2022; 12(22):4083.
https://doi.org/10.3390/nano12224083
Chicago/Turabian Style
Wang, Jintao, Ziwen Lv, Luobin Zhang, Fangcheng Duan, Weiwei Zhang, and Hongtao Chen.
2022. "CoSn3 Intermetallic Nanoparticles for Electronic Packaging" Nanomaterials 12, no. 22: 4083.
https://doi.org/10.3390/nano12224083
APA Style
Wang, J., Lv, Z., Zhang, L., Duan, F., Zhang, W., & Chen, H.
(2022). CoSn3 Intermetallic Nanoparticles for Electronic Packaging. Nanomaterials, 12(22), 4083.
https://doi.org/10.3390/nano12224083