Wang, X.; Cheng, G.; Zhang, Y.; Wang, Y.; Liao, W.; Venkatesh, T.A.
On the Evolution of Nano-Structures at the Al–Cu Interface and the Influence of Annealing Temperature on the Interfacial Strength. Nanomaterials 2022, 12, 3658.
https://doi.org/10.3390/nano12203658
AMA Style
Wang X, Cheng G, Zhang Y, Wang Y, Liao W, Venkatesh TA.
On the Evolution of Nano-Structures at the Al–Cu Interface and the Influence of Annealing Temperature on the Interfacial Strength. Nanomaterials. 2022; 12(20):3658.
https://doi.org/10.3390/nano12203658
Chicago/Turabian Style
Wang, Xiaoli, Guang Cheng, Yang Zhang, Yuxin Wang, Wenjun Liao, and T. A. Venkatesh.
2022. "On the Evolution of Nano-Structures at the Al–Cu Interface and the Influence of Annealing Temperature on the Interfacial Strength" Nanomaterials 12, no. 20: 3658.
https://doi.org/10.3390/nano12203658
APA Style
Wang, X., Cheng, G., Zhang, Y., Wang, Y., Liao, W., & Venkatesh, T. A.
(2022). On the Evolution of Nano-Structures at the Al–Cu Interface and the Influence of Annealing Temperature on the Interfacial Strength. Nanomaterials, 12(20), 3658.
https://doi.org/10.3390/nano12203658