Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites

Wang, Zhengdong; Wang, Xiaozhuo; Wang, Silong; He, Jieyu; Zhang, Tong; Wang, Juan; Wu, Guanglei

doi:10.3390/nano11081898

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Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites

by

Zhengdong Wang

^1,2,

Xiaozhuo Wang

¹,

Silong Wang

¹,

Jieyu He

¹,

Tong Zhang

¹,

Juan Wang

^1,2 and

Guanglei Wu

^3,*

¹

School of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, China

²

Shaanxi Key Laboratory of Nano Materials and Technology, Xi’an University of Architecture and Technology, Xi’an 710055, China

³

State Key Laboratory of Bio-Fibers and Eco-Textiles, Institute of Materials for Energy and Environment, College of Materials Science and Engineering, Qingdao University, Qingdao 266071, China

^*

Author to whom correspondence should be addressed.

Nanomaterials 2021, 11(8), 1898; https://doi.org/10.3390/nano11081898

Submission received: 6 July 2021 / Revised: 19 July 2021 / Accepted: 21 July 2021 / Published: 24 July 2021

(This article belongs to the Special Issue Highly Thermal Conductive Nanocomposites)

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Abstract

Polymer-based composites with high thermal conductivity and dielectric breakdown strength have gained increasing attention due to their significant application potential in both power electronic devices and power equipment. In this study, we successfully prepared novel sandwich AlN/epoxy composites with various layer thicknesses, showing simultaneously and remarkably enhanced dielectric breakdown strength and thermal conductivity. The most optimized sandwich composite, with an outer layer thickness of 120 μm and an inner layer thickness of 60 μm (abbreviated as 120-60) exhibits a high through-plane thermal conductivity of 0.754 W/(m·K) (4.1 times of epoxy) and has a dielectric breakdown strength of 69.7 kV/mm, 8.1% higher compared to that of epoxy. The sandwich composites also have higher in-plane thermal conductivity (1.88 W/(m·K) for 120-60) based on the novel parallel models. The sandwich composites with desirable thermal and electrical properties are very promising for application in power electronic devices and power equipment.

Keywords: sandwich epoxy-based composites; aluminium nitride; dielectric properties; thermal conductivity

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MDPI and ACS Style

Wang, Z.; Wang, X.; Wang, S.; He, J.; Zhang, T.; Wang, J.; Wu, G. Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites. Nanomaterials 2021, 11, 1898. https://doi.org/10.3390/nano11081898

AMA Style

Wang Z, Wang X, Wang S, He J, Zhang T, Wang J, Wu G. Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites. Nanomaterials. 2021; 11(8):1898. https://doi.org/10.3390/nano11081898

Chicago/Turabian Style

Wang, Zhengdong, Xiaozhuo Wang, Silong Wang, Jieyu He, Tong Zhang, Juan Wang, and Guanglei Wu. 2021. "Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites" Nanomaterials 11, no. 8: 1898. https://doi.org/10.3390/nano11081898

APA Style

Wang, Z., Wang, X., Wang, S., He, J., Zhang, T., Wang, J., & Wu, G. (2021). Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites. Nanomaterials, 11(8), 1898. https://doi.org/10.3390/nano11081898

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Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites

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