Qi, H.-r.; Shen, D.-x.; Jia, Y.-j.; An, Y.-c.; Wu, H.; Wei, X.-y.; Zhang, Y.; Zhi, X.-x.; Liu, J.-g.
Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments. Nanomaterials 2021, 11, 1525.
https://doi.org/10.3390/nano11061525
AMA Style
Qi H-r, Shen D-x, Jia Y-j, An Y-c, Wu H, Wei X-y, Zhang Y, Zhi X-x, Liu J-g.
Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments. Nanomaterials. 2021; 11(6):1525.
https://doi.org/10.3390/nano11061525
Chicago/Turabian Style
Qi, Hao-ran, Deng-xiong Shen, Yan-jiang Jia, Yuan-cheng An, Hao Wu, Xin-ying Wei, Yan Zhang, Xin-xin Zhi, and Jin-gang Liu.
2021. "Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments" Nanomaterials 11, no. 6: 1525.
https://doi.org/10.3390/nano11061525
APA Style
Qi, H.-r., Shen, D.-x., Jia, Y.-j., An, Y.-c., Wu, H., Wei, X.-y., Zhang, Y., Zhi, X.-x., & Liu, J.-g.
(2021). Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments. Nanomaterials, 11(6), 1525.
https://doi.org/10.3390/nano11061525
