Shin, H.; Yang, E.; Kim, Y.-H.; Kwak, M.-G.; Kim, Y.
Fabrication of Flexible Electrode with Sub-Tenth Micron Thickness Using Heat-Induced Peelable Pressure-Sensitive Adhesive Containing Amide Groups. Nanomaterials 2021, 11, 1250.
https://doi.org/10.3390/nano11051250
AMA Style
Shin H, Yang E, Kim Y-H, Kwak M-G, Kim Y.
Fabrication of Flexible Electrode with Sub-Tenth Micron Thickness Using Heat-Induced Peelable Pressure-Sensitive Adhesive Containing Amide Groups. Nanomaterials. 2021; 11(5):1250.
https://doi.org/10.3390/nano11051250
Chicago/Turabian Style
Shin, Hyebeom, Eunseong Yang, Yong-Hoon Kim, Min-Gi Kwak, and Youngmin Kim.
2021. "Fabrication of Flexible Electrode with Sub-Tenth Micron Thickness Using Heat-Induced Peelable Pressure-Sensitive Adhesive Containing Amide Groups" Nanomaterials 11, no. 5: 1250.
https://doi.org/10.3390/nano11051250
APA Style
Shin, H., Yang, E., Kim, Y.-H., Kwak, M.-G., & Kim, Y.
(2021). Fabrication of Flexible Electrode with Sub-Tenth Micron Thickness Using Heat-Induced Peelable Pressure-Sensitive Adhesive Containing Amide Groups. Nanomaterials, 11(5), 1250.
https://doi.org/10.3390/nano11051250