Chen, X.; Li, X.; Wu, C.; Ma, Y.; Zhang, Y.; Huang, L.; Liu, W.
Optimization of Processing Parameters for Water-Jet-Assisted Laser Etching of Polycrystalline Silicon. Appl. Sci. 2019, 9, 1882.
https://doi.org/10.3390/app9091882
AMA Style
Chen X, Li X, Wu C, Ma Y, Zhang Y, Huang L, Liu W.
Optimization of Processing Parameters for Water-Jet-Assisted Laser Etching of Polycrystalline Silicon. Applied Sciences. 2019; 9(9):1882.
https://doi.org/10.3390/app9091882
Chicago/Turabian Style
Chen, Xuehui, Xiang Li, Chao Wu, Yuping Ma, Yao Zhang, Lei Huang, and Wei Liu.
2019. "Optimization of Processing Parameters for Water-Jet-Assisted Laser Etching of Polycrystalline Silicon" Applied Sciences 9, no. 9: 1882.
https://doi.org/10.3390/app9091882
APA Style
Chen, X., Li, X., Wu, C., Ma, Y., Zhang, Y., Huang, L., & Liu, W.
(2019). Optimization of Processing Parameters for Water-Jet-Assisted Laser Etching of Polycrystalline Silicon. Applied Sciences, 9(9), 1882.
https://doi.org/10.3390/app9091882