Fushimi, T.; Tanaka, Y.; Soda, S.; Matsuda, T.; Sano, T.; Hirose, A.
Thermal Fatigue Properties of Ultrasonically Bonded Copper Joints. Appl. Sci. 2019, 9, 1556.
https://doi.org/10.3390/app9081556
AMA Style
Fushimi T, Tanaka Y, Soda S, Matsuda T, Sano T, Hirose A.
Thermal Fatigue Properties of Ultrasonically Bonded Copper Joints. Applied Sciences. 2019; 9(8):1556.
https://doi.org/10.3390/app9081556
Chicago/Turabian Style
Fushimi, Takahito, Yo Tanaka, Shinnosuke Soda, Tomoki Matsuda, Tomokazu Sano, and Akio Hirose.
2019. "Thermal Fatigue Properties of Ultrasonically Bonded Copper Joints" Applied Sciences 9, no. 8: 1556.
https://doi.org/10.3390/app9081556
APA Style
Fushimi, T., Tanaka, Y., Soda, S., Matsuda, T., Sano, T., & Hirose, A.
(2019). Thermal Fatigue Properties of Ultrasonically Bonded Copper Joints. Applied Sciences, 9(8), 1556.
https://doi.org/10.3390/app9081556