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Open AccessArticle

Effect of Fiber Weave Structure in Printed Circuit Boards on Signal Transmission Characteristics

1
School of Electronics Information Engineering, South China University of Technology, Guangzhou 510640, China
2
China Fastprint Circuit Corporation, Guangzhou 510663, China
3
Dongguan ITEQ Corporation, Dongguan 523000, China
*
Author to whom correspondence should be addressed.
Appl. Sci. 2019, 9(2), 353; https://doi.org/10.3390/app9020353
Received: 26 November 2018 / Revised: 28 December 2018 / Accepted: 11 January 2019 / Published: 21 January 2019
(This article belongs to the Special Issue Applied Sciences Based on and Related to Computer and Control)
In this paper, we characterized and compared signal transmission performances of traces with different specifications of fiber weave. Measurements demonstrated that the dielectric constant, impedance fluctuation, and differential skew were all affected by fiber weave style. For flattened fiber weaves, the dielectric constant fluctuation reached 0.18, the impedance fluctuation amplitude was 1.0 Ω, and the differential skew was 2 ps/in. For conventional fiber weaves, the three parameters were 0.44, 2.5 Ω, and 4 ps/inch respectively. Flattened fiber weave was more favorable for high-speed signal control. We also discussed the other methods to improve the fiber weave effect. It turned out that NE-glass (new electronic glass) fiber weave also had better performance in reducing impedance fluctuation and differential skew. Furthermore, made the signal traces and fiber weave bundles with an angle or designing the long signal line parallel to the weft direction both are simple and effective methods to solve this problem. View Full-Text
Keywords: fiber weave effect; high-speed; impedance fluctuation; differential skew fiber weave effect; high-speed; impedance fluctuation; differential skew
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MDPI and ACS Style

Chen, B.; Yao, R.; Wang, H.; Geng, K.; Li, J. Effect of Fiber Weave Structure in Printed Circuit Boards on Signal Transmission Characteristics. Appl. Sci. 2019, 9, 353.

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