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Journal: Appl. Sci., 2019
Volume: 9
Number: 157
157
Article: Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging
Authors: by Hiroaki Tatsumi, Adrian Lis, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba and Akio Hirose
Link: https://www.mdpi.com/2076-3417/9/1/157

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