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Journal: Appl. Sci., 2017
Volume: 7
Number: 1047

Article: The Challenges of Advanced CMOS Process from 2D to 3D
Authors: by Henry H. Radamson, Yanbo Zhang, Xiaobin He, Hushan Cui, Junjie Li, Jinjuan Xiang, Jinbiao Liu, Shihai Gu and Guilei Wang
Link: https://www.mdpi.com/2076-3417/7/10/1047

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