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Journal: Appl. Sci., 2025
Volume: 15
Number: 544

Article: The Numerical Simulation of the Transient Plane Heat Source Method to Measure the Thermophysical Properties of Materials
Authors: by Jianyuan Sun, Siwen Zhang, Pengcheng Shi, Zao Yi, Yougen Yi and Qingdong Zeng
Link: https://www.mdpi.com/2076-3417/15/2/544

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