Yoshida, S.; Hihara, K.; Furuya, J.; Osawa, T.; Yaida, A.; Nishiyama, N.; Okino, A.
Development of a Low-Particle Emission Linear Atmospheric Plasma Device for Hydrophilization of Silicon Wafers. Appl. Sci. 2025, 15, 10349.
https://doi.org/10.3390/app151910349
AMA Style
Yoshida S, Hihara K, Furuya J, Osawa T, Yaida A, Nishiyama N, Okino A.
Development of a Low-Particle Emission Linear Atmospheric Plasma Device for Hydrophilization of Silicon Wafers. Applied Sciences. 2025; 15(19):10349.
https://doi.org/10.3390/app151910349
Chicago/Turabian Style
Yoshida, Sho, Koki Hihara, Junnosuke Furuya, Taiki Osawa, Akane Yaida, Nobuhiko Nishiyama, and Akitoshi Okino.
2025. "Development of a Low-Particle Emission Linear Atmospheric Plasma Device for Hydrophilization of Silicon Wafers" Applied Sciences 15, no. 19: 10349.
https://doi.org/10.3390/app151910349
APA Style
Yoshida, S., Hihara, K., Furuya, J., Osawa, T., Yaida, A., Nishiyama, N., & Okino, A.
(2025). Development of a Low-Particle Emission Linear Atmospheric Plasma Device for Hydrophilization of Silicon Wafers. Applied Sciences, 15(19), 10349.
https://doi.org/10.3390/app151910349