Solid-Solution Evolution Behavior of Al-Cu3-Si-Mg During the MMDF Process
Abstract
1. Introduction
2. Experimental Materials and Methods
3. Experimental Results
3.1. Microscopic Solidified Structure Under Pressure
3.2. Effect of Solution Temperature on Irregular Eutectic Fraction
3.3. Effect of Solution Temperature on the Morphology and Size of the Irregular Eutectic
3.4. Effect of Solution Temperature on Compound and Second Phase
4. Discussion
4.1. Analysis of Dissolution Behavior of the Irregular Intergranular Eutectic
4.2. Kinetic Model of Irregular Eutectic Dissolution
5. Conclusions
- The as-cast microstructures of Al-Cu3-Si-Mg alloy were studied by SEM. Separated irregular eutectics (α+Al2Cu) were mainly found at the α-Al grain boundary; the irregular bright white eutectics Al2Cu were distributed separately, while the eutectic α had no obvious characteristics. Spherical granular phases θ(Al2Cu) were found in the primary α-Al. The cross-shaped phases Mg2Si grew near the grain boundaries inside the α-Al grain. Q (Al5Cu2Mg8Si6) exists at the intersection of grain boundaries.
- When the solution temperature is 480 °C~510 °C, the eutectic radius and the width of the intercrystal plate eutectic radius decrease significantly with the increase in solution temperature, decreasing, respectively, from 2.8 μm to 0.3 μm and from 2.96 μm to 0.7 μm. When the solution temperature exceeds 510 °C, the width and radius of the intercrystal plate eutectic radius do not decrease significantly with the increase in solution temperature. The diameter and quantity of the second phase θ(Al2Cu) decreased with the increase in temperature when the solution temperature was between 480 and 510 °C, decreasing from 0.78 μm to 0.19 μm and increasing from 66 μm to 120 μm. The diameter and quantity of θ(Al2Cu) do not change much when the temperature exceeds 510 °C. The morphology and diameter of the polygonal forms remained basically unchanged during the solution process, and the β (Mg2Si) near the grain boundary dissolved at 480 °C.
- The dissolution kinetics model of the intergranular irregular eutectic in the solution process was established, which was expressed by connecting solution temperature, solution time and the average width of the irregular eutectic.
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
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Cu | Si | Mg | Mn | Ti | Fe | La/Ce | Al |
---|---|---|---|---|---|---|---|
2.4 | 0.8 | 0.56 | 0.5 | 0.073 | 0.1 | 0.15 | Bal |
Serial Number | Solid-Solution Treatment | |
---|---|---|
Heating Temperature/°C | Holding Time/min | |
1 | 480 | 30 |
2 | 495 | 30 |
3 | 510 | 15 |
4 | 510 | 30 |
5 | 510 | 45 |
6 | 510 | 60 |
7 | 525 | 30 |
8 | 540 | 30 |
Phase | Average Grain Size/Diameter (μm) |
---|---|
E(α+Al2Cu) | 2.5~3 |
Q (Al5Cu2Mg8Si6) | 2~2.5 |
φ(AlxTi9La2Ce6Cu) | 25~30 |
θ(Al2Cu) | 1~2 |
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Wu, T.; Xing, S.; Yan, G. Solid-Solution Evolution Behavior of Al-Cu3-Si-Mg During the MMDF Process. Appl. Sci. 2025, 15, 9478. https://doi.org/10.3390/app15179478
Wu T, Xing S, Yan G. Solid-Solution Evolution Behavior of Al-Cu3-Si-Mg During the MMDF Process. Applied Sciences. 2025; 15(17):9478. https://doi.org/10.3390/app15179478
Chicago/Turabian StyleWu, Tong, Shuming Xing, and Guangyuan Yan. 2025. "Solid-Solution Evolution Behavior of Al-Cu3-Si-Mg During the MMDF Process" Applied Sciences 15, no. 17: 9478. https://doi.org/10.3390/app15179478
APA StyleWu, T., Xing, S., & Yan, G. (2025). Solid-Solution Evolution Behavior of Al-Cu3-Si-Mg During the MMDF Process. Applied Sciences, 15(17), 9478. https://doi.org/10.3390/app15179478