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Journal: Appl. Sci., 2023
Volume: 13
Number: 155

Article: Low-Quality Integrated Circuits Image Verification Based on Low-Rank Subspace Clustering with High-Frequency Texture Components
Authors: by Guoliang Tan, Zexiao Liang, Yuan Chi, Qian Li, Bin Peng, Yuan Liu and Jianzhong Li
Link: https://www.mdpi.com/2076-3417/13/1/155

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