Order Article Reprints

Wang F, Yang X, Zhao Y, Wu J, Guo Z, He Z, Fan Z, Yang F. Low-Temperature Direct Bonding of SiC to Si via Plasma Activation. Applied Sciences. 2022; 12(7):3261. https://doi.org/10.3390/app12073261

Wang, Fengxuan, Xiang Yang, Yongqiang Zhao, Jingmin Wu, Zhiyu Guo, Zhi He, Zhongchao Fan, and Fuhua Yang. 2022. "Low-Temperature Direct Bonding of SiC to Si via Plasma Activation" Applied Sciences 12, no. 7: 3261. https://doi.org/10.3390/app12073261

Wang, F., Yang, X., Zhao, Y., Wu, J., Guo, Z., He, Z., Fan, Z., & Yang, F. (2022). Low-Temperature Direct Bonding of SiC to Si via Plasma Activation. Applied Sciences, 12(7), 3261. https://doi.org/10.3390/app12073261