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Journal: Appl. Sci., 2022
Volume: 12
Number: 3261
Article:
Low-Temperature Direct Bonding of SiC to Si via Plasma Activation
Authors:
by
Fengxuan Wang, Xiang Yang, Yongqiang Zhao, Jingmin Wu, Zhiyu Guo, Zhi He, Zhongchao Fan and Fuhua Yang
Link:
https://www.mdpi.com/2076-3417/12/7/3261
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