Kim, J.-H.; Seo, Y.; Jang, J.T.; Park, S.; Kang, D.; Park, J.; Han, M.; Kim, C.; Park, D.-W.; Kim, D.H.
Reliability-Aware SPICE Compatible Compact Modeling of IGZO Inverters on a Flexible Substrate. Appl. Sci. 2021, 11, 4838.
https://doi.org/10.3390/app11114838
AMA Style
Kim J-H, Seo Y, Jang JT, Park S, Kang D, Park J, Han M, Kim C, Park D-W, Kim DH.
Reliability-Aware SPICE Compatible Compact Modeling of IGZO Inverters on a Flexible Substrate. Applied Sciences. 2021; 11(11):4838.
https://doi.org/10.3390/app11114838
Chicago/Turabian Style
Kim, Je-Hyuk, Youngjin Seo, Jun Tae Jang, Shinyoung Park, Dongyeon Kang, Jaewon Park, Moonsup Han, Changwook Kim, Dong-Wook Park, and Dae Hwan Kim.
2021. "Reliability-Aware SPICE Compatible Compact Modeling of IGZO Inverters on a Flexible Substrate" Applied Sciences 11, no. 11: 4838.
https://doi.org/10.3390/app11114838
APA Style
Kim, J.-H., Seo, Y., Jang, J. T., Park, S., Kang, D., Park, J., Han, M., Kim, C., Park, D.-W., & Kim, D. H.
(2021). Reliability-Aware SPICE Compatible Compact Modeling of IGZO Inverters on a Flexible Substrate. Applied Sciences, 11(11), 4838.
https://doi.org/10.3390/app11114838