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Journal: Appl. Sci., 2020
Volume: 10
Number: 8192
Article:
Thermal Exchange and Skid Resistance of Chip Seal with Various Aggregate Types and Morphologies
Authors:
by
Minghua Wei, Shaopeng Wu, Peide Cui, Tianyuan Yang and Yang Lv
Link:
https://www.mdpi.com/2076-3417/10/22/8192
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