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Open AccessArticle

Plasma Printing of an AISI316 Micro-Meshing Punch Array for Micro-Embossing onto Copper Plates

1
Komatsu-Seiki Kosakusho, Co., Ltd., R&D section, Suwa, Nagano 392-0012, Japan
2
Surface Engineering Design Laboratory, Shibaura Institute of Technology, Ohta, Tokyo 144-0045, Japan
3
Chuo Denshi Kogyo, Co., Ltd., Ujyou, Kumamoto 869-0512, Japan
4
MICROTEX Inc., Ohta, Tokyo 144-0051, Japan
*
Author to whom correspondence should be addressed.
Metals 2019, 9(4), 396; https://doi.org/10.3390/met9040396
Received: 23 February 2019 / Revised: 25 March 2019 / Accepted: 27 March 2019 / Published: 30 March 2019
(This article belongs to the Special Issue Metal Micro-forming)
Packaging using thermoplastic molding for hollowed GaN chips were requested for a leak-proof micro-joining between plastic molds and copper-based substrates. The design and engineering of micro-textures is a key technology for putting leak-proof packaging into practice. In the present paper, a micro-meshing punch array was prepared using plasma-nitriding-assisted printing. Two-dimensional original patterns were screen-printed onto an AISI316 die substrate and plasma nitrided at 673 K for 14.4 ks (or 4 h). The unprinted surfaces were selectively nitrogen super-saturated to have more nitrogen content than 5 mass% and a higher hardness than 1200 HV. The printed surfaces were selectively sand blasted to fabricate the micro-meshing punch array for micro-embossing. A computer numerically controlled stamping system was utilized to describe the micro-embossing behavior onto copper substrates and to investigate how the micro-textures on the array was transcribed onto the copper. Reduction of takt time as well as flexibility in the micro-grooving were discussed with reference to the picosecond laser machining and mechanical milling processes. View Full-Text
Keywords: plasma printing; micro-texturing; screen printing; low-temperature plasma nitriding; selective anisotropic nitrogen embedding; selective hardening; sand blasting; AISI316; micro-meshing punch array; copper plates plasma printing; micro-texturing; screen printing; low-temperature plasma nitriding; selective anisotropic nitrogen embedding; selective hardening; sand blasting; AISI316; micro-meshing punch array; copper plates
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MDPI and ACS Style

Shiratori, T.; Aizawa, T.; Saito, Y.; Wasa, K. Plasma Printing of an AISI316 Micro-Meshing Punch Array for Micro-Embossing onto Copper Plates. Metals 2019, 9, 396. https://doi.org/10.3390/met9040396

AMA Style

Shiratori T, Aizawa T, Saito Y, Wasa K. Plasma Printing of an AISI316 Micro-Meshing Punch Array for Micro-Embossing onto Copper Plates. Metals. 2019; 9(4):396. https://doi.org/10.3390/met9040396

Chicago/Turabian Style

Shiratori, Tomomi; Aizawa, Tatsuhiko; Saito, Yasuo; Wasa, Kenji. 2019. "Plasma Printing of an AISI316 Micro-Meshing Punch Array for Micro-Embossing onto Copper Plates" Metals 9, no. 4: 396. https://doi.org/10.3390/met9040396

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