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Journal: Metals, 2019
Volume: 9
Number: 1044

Article: Optimization of Copper Thermocompression Diffusion Bonding under Vacuum: Microstructural and Mechanical Characteristics
Authors: by Michail Samouhos, Antonis Peppas, Panagiotis Angelopoulos, Maria Taxiarchou and Petros Tsakiridis
Link: https://www.mdpi.com/2075-4701/9/10/1044

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