Effect of Tempering on Microstructure, Strength and Toughness Gradient in Quenched Low-Alloy Medium-Thickness Steel Plate
Abstract
1. Introduction
2. Materials and Methods
2.1. Experimental Material and Heat-Treatment Procedure
2.2. Mechanical Property Testing
2.3. Microstructural Characterization
3. Results
3.1. Microstructure
3.2. Mechanical Properties
3.2.1. Tensile Properties
3.2.2. Impact Toughness
3.2.3. Microhardness
4. Discussion
4.1. Phase-Transformation Mechanism
4.2. Relationship Between Microstructure and Mechanical Properties
5. Conclusions
- A distinct through-thickness microstructural gradient exists in the DQ condition. The upper surface layer is mainly composed of F and GB with a small amount of LB, and the M/A constituent tends to enrich at grain boundaries and phase boundaries. The mid-thickness is dominated by F with GB as the secondary constituent; M/A is less abundant and more uniformly dispersed. The lower surface layer exhibits an intermediate ferrite grain size (7.22 µm), which is 2.39 µm larger than that of the upper surface layer (4.83 µm) (DQ condition), and it remains primarily F + GB, while M/A is mostly blocky/short-rod in morphology and is discontinuously distributed along grain boundaries.
- The microstructural gradient corresponds to a pronounced property gradient. In the DQ condition, the YS/UTS values of the upper surface layer, mid-thickness, and lower surface layer are 528 MPa/760 MPa, 498 MPa/675 MPa, and 556 MPa/713 MPa, respectively. Notably, in the upper surface layer, GB/LB/M/A enrichment at grain boundaries increases the hard/soft mismatch, so the interfacial F yields earlier with strain localization; the 0.2% offset-yield point is reached sooner, giving a lower apparent YS. In contrast, the lower surface layer is mainly F + GB with little LB; early strain partitioning is more compatibility-controlled, delaying the offset-yield point to a higher strain and thus giving a higher apparent YS. Consequently, the YS difference between the two surface layers appears small.
- The room-temperature impact-absorbed energy increases from 223.23 J in the upper surface layer and 229.88 J at the mid-thickness to 261.22 J in the lower surface layer. The upper surface layer shows a lower impact energy because hard and brittle constituents near grain boundaries increase crack-initiation sensitivity. In contrast, although the mid-thickness benefits from toughening due to plastic energy dissipation by the soft phase, M/A still contributes to crack initiation; therefore, the absorbed energies of the upper surface layer and the mid-thickness are very similar.
- After tempering at 530 °C for 1.5 h, the upper surface layer and mid-thickness evolve toward a similar F + TS-dominated microstructure, whereas the lower surface layer remains characterized by F + SC. Accordingly, the through-thickness strength profile is reshaped, and the mid-thickness exhibits the peak strength (619 MPa/805 MPa). The impact toughness of the upper surface layer and mid-thickness is improved to 240.62 J and 235.56 J, respectively, because tempering reduces the crack-initiation sensitivity associated with hard/brittle constituents (especially M/A) near grain boundaries and makes the tempered microstructure more uniform through the thickness, thereby markedly reducing the overall through-thickness fluctuation.
- After tempering at 580 °C × 1.5 h, further recovery and equiaxed morphology occur in the mid-thickness and lower surface layer, driving the matrix toward a more equiaxed ferrite morphology and reducing dislocation-related obstacles. As a result, the Charpy impact-absorbed energies at the three locations tend to converge: 235.31 J (upper surface layer), 229.58 J (mid-thickness), and 230.22 J (lower surface layer). However, the higher tempering temperature also promotes pronounced ferrite grain growth (the ferrite grain size in the DQT580 condition increases to 11.50 µm, 12.84 µm, and 13.50 µm for the upper surface layer, mid-thickness, and lower surface layer, respectively, compared with 4.83 µm, 8.12 µm, and 7.22 µm in the as-DQ condition), which reduces crack-propagation resistance and thereby leads to a marked decrease in the toughness of the lower surface layer relative to the DQ condition.
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
References
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| C | Si | Mn | Cr | Mo | Al | Nb | Ti | Fe |
|---|---|---|---|---|---|---|---|---|
| 0.15 | 0.25 | 1.45 | 0.40 | 0.18 | 0.025 | 0.025 | 0.015 | Bal. |
| Condition/Property | Upper Surface Layer | Mid-Thickness | Lower Surface Layer |
|---|---|---|---|
| DQ—YS (MPa) | 528.00 | 498.00 | 556.00 |
| DQ—UTS (MPa) | 760.00 | 675.00 | 713.00 |
| DQ—Total elongation, TE (%) | 40.10 | 30.13 | 29.86 |
| DQ—Impact energy (J) | 223.23 | 229.88 | 261.22 |
| DQ-T530—YS (MPa) | 524.00 | 619.00 | 489.00 |
| DQ-T530—UTS (MPa) | 744.00 | 805.00 | 762.00 |
| DQ-T530—Total elongation, TE (%) | 40.50 | 30.67 | 46.64 |
| DQ-T530—Impact energy (J) | 240.62 | 235.56 | 250.32 |
| DQ-T580—YS (MPa) | 589.00 | 512.00 | 581.00 |
| DQ-T580—UTS (MPa) | 762.00 | 782.00 | 751.00 |
| DQ-T580—Total elongation, TE (%) | 31.39 | 40.85 | 32.11 |
| DQ-T580—Impact energy (J) | 235.31 | 229.58 | 230.22 |
| Condition | Upper Surface Layer | Mid-Thickness | Lower Surface Layer |
|---|---|---|---|
| DQ | 201.25 | 210.17 | 183.77 |
| DQ-T530 | 262.82 | 246.14 | 242.26 |
| DQ-T580 | 270.32 | 253.70 | 230.88 |
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Guan, B.; Bai, S.; Zhang, Y.; Fu, P.; Lu, H.; Zhu, H.; Chen, X.; Guo, K.; Wang, H.; Chen, Y. Effect of Tempering on Microstructure, Strength and Toughness Gradient in Quenched Low-Alloy Medium-Thickness Steel Plate. Metals 2026, 16, 243. https://doi.org/10.3390/met16030243
Guan B, Bai S, Zhang Y, Fu P, Lu H, Zhu H, Chen X, Guo K, Wang H, Chen Y. Effect of Tempering on Microstructure, Strength and Toughness Gradient in Quenched Low-Alloy Medium-Thickness Steel Plate. Metals. 2026; 16(3):243. https://doi.org/10.3390/met16030243
Chicago/Turabian StyleGuan, Boyu, Shaobin Bai, Yongqing Zhang, Peimao Fu, Haitao Lu, Hejia Zhu, Xingchi Chen, Kaikai Guo, Haonan Wang, and Yongan Chen. 2026. "Effect of Tempering on Microstructure, Strength and Toughness Gradient in Quenched Low-Alloy Medium-Thickness Steel Plate" Metals 16, no. 3: 243. https://doi.org/10.3390/met16030243
APA StyleGuan, B., Bai, S., Zhang, Y., Fu, P., Lu, H., Zhu, H., Chen, X., Guo, K., Wang, H., & Chen, Y. (2026). Effect of Tempering on Microstructure, Strength and Toughness Gradient in Quenched Low-Alloy Medium-Thickness Steel Plate. Metals, 16(3), 243. https://doi.org/10.3390/met16030243

