Yang, X.; Zong, X.; Wang, C.; Sun, Y.; Wang, J.; Zheng, B.; Fang, J.; Yan, X.; Shi, X.
The Coupling Relationship of Dynamic Recrystallization and Lamellar Globularization of the BT25y Alloy During High-Temperature Deformation. Metals 2026, 16, 157.
https://doi.org/10.3390/met16020157
AMA Style
Yang X, Zong X, Wang C, Sun Y, Wang J, Zheng B, Fang J, Yan X, Shi X.
The Coupling Relationship of Dynamic Recrystallization and Lamellar Globularization of the BT25y Alloy During High-Temperature Deformation. Metals. 2026; 16(2):157.
https://doi.org/10.3390/met16020157
Chicago/Turabian Style
Yang, Xuemei, Xiaojing Zong, Cheng Wang, Yueyu Sun, Jiayuan Wang, Boshi Zheng, Juncheng Fang, Xuewei Yan, and Xiaonan Shi.
2026. "The Coupling Relationship of Dynamic Recrystallization and Lamellar Globularization of the BT25y Alloy During High-Temperature Deformation" Metals 16, no. 2: 157.
https://doi.org/10.3390/met16020157
APA Style
Yang, X., Zong, X., Wang, C., Sun, Y., Wang, J., Zheng, B., Fang, J., Yan, X., & Shi, X.
(2026). The Coupling Relationship of Dynamic Recrystallization and Lamellar Globularization of the BT25y Alloy During High-Temperature Deformation. Metals, 16(2), 157.
https://doi.org/10.3390/met16020157
