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Journal: Metals, 2025
Volume: 15
Number: 915
915
Article: Microstructure and Properties of Bi-Sn, Bi-Sn-Sb, and Bi-Sn-Ag Solder Alloys for Electronic Applications
Authors: by Andrei-Alexandru Ilie, Florentina Niculescu, Gheorghe Iacob, Ion Pencea, Florin Miculescu, Robert Bololoi, Dumitru-Valentin Drăguț, Alexandru-Cristian Matei, Mihai Ghiţă, Adrian Priceputu and Constantin Ungureanu
Link: https://www.mdpi.com/2075-4701/15/8/915

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