1. Introduction
Residual stress refers to the self-equilibrating stress that remains within a material in the absence of external forces. The formation of residual stress primarily arises from plastic deformation, phase transformations, or thermal shock within the material, such as those caused by tension or compression deformation, heat treatment, chemical processing, etc. [
1,
2]. When the residual stress is improperly distributed, it may lead to component failure or fracture, and, in severe cases, threaten the safety of equipment [
3,
4,
5]. Therefore, the accurate measurement and evaluation of residual stress are not only essential for predicting structural life and preventing failure but also serve as an important basis for process optimization in machining, heat treatment, and plastic deformation.
Residual stresses can usually be measured by specialized instruments, including X-ray diffraction, neutron diffraction, the hole-drilling method, stress corrosion methods, and nanoindentation techniques; however, each has some limitations: diffraction-based methods require expensive equipment, traditional mechanical and corrosion methods are limited in spatial resolution and measurement depth, while the nanoindentation technique demands small dimensions and smooth samples with low surface roughness [
6,
7,
8,
9,
10,
11,
12]. Thus, obtaining residual stress based on their plastic deformation process, rather than using the methods mentioned above, becomes very interesting, and is necessary for research and application. Previous studies, such as that by Singh et al. [
13], have demonstrated that plastic deformation can induce complex residual stress fields, typically characterized by compressive surface stress and tensile core stress. Wang et al. [
14] measured the residual stress of 0.19 mm electronic copper foil after rolling using the XRD method and reported surface compressive stresses of 35 MPa in the rolling direction and 32 MPa in the transverse direction. Greco et al. [
15] employed nanoindentation combined with finite element analysis to establish a method for deriving surface residual stress distributions from indentation responses. Cao et al. [
16] used nanoindentation to evaluate the residual stress in C194 lead-frame copper strips. However, these studies primarily focused on specific loading stress states and did not establish explicit relationships between the macroscopic plastic strain and the direction-dependent residual stresses. This thus forms the main objective of the present work.
For this purpose, this paper investigates the relationship between plastic deformation and residual stress. Compression and tension have been employed, and by loading different compression plastic deformations or tension plastic deformations, different compression residual stresses or tension residual stresses can be produced. Rectangle compression specimens and plate tension specimens are used to evaluate the residual stress parallel to the compression direction or tension direction, while cylinder compression specimens and cylinder tension specimens are used to evaluate the residual stress perpendicular to the compression direction or tension direction. Residual stress is measured using the nanoindentation technique.
To measure residual stress using the nanoindentation method, the fixed indentation-depth mode in the highly reliable Suresh equation is utilized [
17,
18,
19,
20,
21]. The equation for calculating residual compressive stress and tensile stress under the fixed indentation depth mode is as follows:
where
H is the nanoindentation hardness, calculated using the Oliver–Pharr (O&P) [
22] method, and its expression is given by
,
Pmax is maximum indentation load,
A is the contact area between the indenter and the specimen surface in the residual stress state,
A0 is the contact area between the indenter and the specimen surface in the stress-free state,
,
hc is the contact depth, and α = 0.25 for the Berkovich indenter. Thus, by these equations, the residual stress can be obtained.
In this study, nanoindentation is employed to systematically measure the residual stress components in copper subjected to parallel and perpendicular compression and tension at different strain levels. The obtained data are used to establish quantitative relationships between strain and residual stress, providing valuable references for engineering applications.
2. Materials and Methods
T2-type copper (Chinese standard grade) produced in China was used in this study, and its nominal chemical composition is listed in
Table 1. Compression and tension specimens with different shapes and dimensions were prepared, as shown in
Figure 1. For the rectangle compression specimens and plate tension specimens, stress-relief annealing was performed before test. The annealing process is as follows: heating to 300 °C within 35 min, holding at 300 °C for 1 h, and then furnace cooling to room temperature. For the cylinder compression specimens and cylinder tension specimens, no stress-relief annealing was performed before the test, and the specimens were tested in their as-extruded condition (supply status), to ensure two different stress states.
The compression tests were conducted on a Gleeble-1500 thermo-mechanical simulator (Duffers Scientific, Poestenkill, NY, USA) under the same strain rate of 1 × 10−3 s−1. Tensile tests were performed on an MTS-810 universal testing machine at a constant strain rate of 1 × 10−3 s−1, using an extensometer with a gauge length of 20 mm. The cylindrical tension specimens were gripped by a threaded joint with testing machine tension, to ensure that deformation occurred throughout the specimen. To avoid non-uniform deformation during loading, strain levels of 5%, 7.5%, and 10% were applied to the rectangular specimens, whereas strains of 10%, 20%, and 30% were applied to the cylindrical specimens. Before tension and compression, the specimens were ground and polished in order to minimize the effect of grinding and polishing on residual stress. The specimen surfaces were prepared by sequential grinding with 400#, 800#, 1200#, and 2000# grit silicon carbide papers, followed by polishing with diamond suspensions of 3 µm, 1 µm, and 0.05 µm, respectively.
The hardness of the material was determined using a Nano Indenter G200 (Agilent, Santa Clara, CA, USA) system equipped with a Berkovich three-sided pyramidal diamond tip. For the Berkovich indenter, the indentation side length is 7.53 times the penetration depth (a = 7.53 h, a is the indentation side length, and h is the actual penetration depth of the indenter into the material during loading). A fixed penetration depth of 2000 nm was adopted in the nanoindentation tests. After deformation, the ground and polished specimens were used for nanoindentation, no cut from the deformed specimens.
Hardness was calculated using the Oliver and Pharr (O&P) method [
23], and residual stress was calculated using the existing Suresh model. Compressive stress is defined as a negative value, and tensile stress is defined as a positive value.
The indentation impressions were observed under the secondary electron mode of a scanning electron microscope (SEM). No etching was performed before the SEM observation. The SEM observations were carried out at an accelerating voltage of 5 kV and a beam current of 10 µA.
Author Contributions
Conceptualization, X.S.; methodology, G.L., H.Q., and J.M.; software, G.L., H.Q., and J.M.; validation, G.L., H.Q., and J.M.; formal analysis, G.L., H.Q., and J.M.; investigation, G.L.; resources, G.L., H.Q., and J.M.; data curation, G.L., H.Q., and J.M.; writing—original draft preparation, G.L.; writing—review and editing, G.L., and X.S.; visualization, G.L., and X.S.; supervision, X.S.; project administration, X.S.; funding acquisition, X.S. All authors have read and agreed to the published version of the manuscript.
Funding
This research was funded by National Key Research and Development Program of China (2023YFB3710401, 2023YFB3710403).
Data Availability Statement
The original contributions presented in this study are included in the article. Further inquiries can be directed to the corresponding author.
Conflicts of Interest
The authors declare no conflicts of interest.
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Figure 1.
Schematic of residual stress distribution of specimens under compression (tension): (a) rectangle compression specimens; (b) cylinder compression specimen; (c) plate tension specimen; (d) cylinder tension specimen.
Figure 2.
Compression curve of rectangle compression specimens: (a) A-C-5%; (b) A-C-7.5%; (c) A-C-10%.
Figure 3.
Compression curves of cylinder compression specimens: (a) B-C-10%; (b) B-C-20%; (c) B-C-30%.
Figure 4.
SE images of nanoindentation impressions of rectangle compression specimens: (a) A-C-0%; (b) A-C-5%; (c) A-C-7.5%; (d) A-C-10%; (e) edge protrusion data.
Figure 5.
SE images of nanoindentation impressions of cylinder compression specimens: (a) B-C-0%; (b) B-C-10%; (c) B-C-20%; (d) B-C-30%; (e) edge protrusion data.
Figure 6.
Load–displacement curves under compression at a fixed penetration depth of 2000 nm: (a) rectangle compression specimens; (b) cylinder compression specimens.
Figure 7.
(a1) Hardness and residual stress curves of rectangle compression specimens with compression stress; (a2) residual stress curves of rectangle compression specimens with compression strain; (b1) hardness and residual stress curves of cylinder compression specimens with compression stress; (b2) residual stress curves of cylinder compression specimen with compression strain.
Figure 8.
Tension curves of plate tension specimens: (a) A-T-5%; (b) A-T-7.5%; (c) A-T-10%.
Figure 9.
Tension curve of cylinder tension specimens: (a) B-T-10%; (b) B-T-20%; (c) B-T-30%.
Figure 10.
SE images of nanoindentation impressions of plate tension specimens: (a) A-T-0%; (b) A-T-5%; (c) A-T-7.5%; (d) A-T-10%; (e) edge protrusion data.
Figure 11.
SE images of nanoindentation impressions of cylinder tension specimens: (a) B-T-0%; (b) B-T-10%; (c) B-T-20%; (d) B-T-30%; (e) edge protrusion data.
Figure 12.
Load–displacement curves under compression at a fixed penetration depth of 2000 nm: (a) plate tension specimens; (b) cylinder tension specimens.
Figure 13.
(a1) Hardness and residual stress curves of plate tension specimens with tension stress; (a2) residual stress curves of plate tension specimens with tension strain; (b1) hardness and residual stress curves of cylinder tension specimens with tension stress; (b2) residual stress curves of cylinder tension specimen with tension strain.
Table 1.
Nominal chemical composition range of T2 copper (wt.%).
| Composition | Cu | Total Impurity Content |
|---|
| Content | ≥99.90 | ≤0.1 |
Table 2.
Compression strains and marks of compression tests.
| | Compression Stress (MPa) | Compression Strain (%) | Specimen Mark |
|---|
| Rectangle compression specimens | 0 | 0 | A-C-0% |
| 248.1 | 5.0 | A-C-5% |
| 284.3 | 7.5 | A-C-7.5% |
| 299.8 | 10.0 | A-C-10% |
| Cylinder compression specimens | 0 | 0 | B-C-0% |
| 376.5 | 10.0 | B-C-10% |
| 420.3 | 20.0 | B-C-20% |
| 510.5 | 30.0 | B-C-30% |
Table 3.
Nanoindentation hardness and residual stress of rectangle compression specimens at a fixed penetration depth of 2000 nm.
| Specimen | Pmax/mN | S/(mN/nm) | | hc/nm | AO&P/µm2 | H/GPa | /MPa |
|---|
| A-C-0% | 121.83 | 1.5057 | 0.75 | 1939.32 | 94.24 | 1.29 | - |
| A-C-5% | 124.84 | 1.5090 | 0.75 | 1937.95 | 94.11 | 1.33 | −7.4 |
| A-C-7.5% | 127.67 | 1.5228 | 0.75 | 1937.12 | 94.03 | 1.36 | −12.1 |
| A-C-10% | 130.48 | 1.5442 | 0.75 | 1936.63 | 93.98 | 1.39 | −15.4 |
Table 4.
Nanoindentation hardness and residual stress of cylinder compression specimens at a fixed penetration depth of 2000 nm.
| Specimen | Pmax/mN | S/(mN/nm) | | hc/nm | AO&P/µm2 | H/GPa | /MPa |
|---|
| B-C-0% | 136.78 | 1.2482 | 0.75 | 1917.81 | 92.18 | 1.48 | - |
| B-C-10% | 138.24 | 1.2531 | 0.75 | 1917.26 | 92.13 | 1.50 | −3.2 |
| B-C-20% | 139.66 | 1.2628 | 0.75 | 1917.05 | 92.11 | 1.52 | −4.6 |
| B-C-30% | 140.04 | 1.2630 | 0.75 | 1916.84 | 92.09 | 1.52 | −6.0 |
Table 5.
Tension strains and marks of tension tests.
| | Tension Stress (MPa) | Tension Strain (%) | Specimen Mark |
|---|
| Plate tension specimens | 0 | 0 | A-T-0% |
| 220.6 | 5.0 | A-T-5% |
| 225.6 | 7.50 | A-T-7.5% |
| 230.0 | 10.0 | A-T-10% |
| Cylinder tension specimens | 0 | 0 | B-T-0% |
| 258.8 | 10.0 | B-T-10% |
| 265.8 | 20.0 | B-T-20% |
| 270.8 | 30.0 | B-T-30% |
Table 6.
Nanoindentation hardness and residual stress of plate tension specimens at a fixed penetration depth of 2000 nm.
| Specimen | Pmax/mN | S/(mN/nm) | | hc/nm | AO&P/µm2 | H/GPa | /MPa |
|---|
| A-T-0% | 121.44 | 1.3427 | 0.75 | 1932.17 | 93.55 | 1.30 | - |
| A-T-5% | 117.54 | 1.3478 | 0.75 | 1934.59 | 93.78 | 1.25 | 3.1 |
| A-T-7.5% | 115.06 | 1.3631 | 0.75 | 1936.69 | 93.98 | 1.22 | 5.6 |
| A-T-10% | 110.65 | 1.4173 | 0.75 | 1941.45 | 94.44 | 1.17 | 11.0 |
Table 7.
Nanoindentation hardness and residual stress of cylinder tension specimens at a fixed penetration depth of 2000 nm.
| Specimen | Pmax/mN | S/(mN/nm) | | hc/nm | AO&P/µm2 | H/GPa | /MPa |
|---|
| B-T-0% | 136.16 | 1.474 | 0.75 | 1930.72 | 93.41 | 1.46 | - |
| B-T-10% | 134.94 | 1.476 | 0.75 | 1931.43 | 93.48 | 1.44 | 1.1 |
| B-T-20% | 132.60 | 1.491 | 0.75 | 1933.30 | 93.66 | 1.42 | 3.8 |
| B-T-30% | 130.26 | 1.505 | 0.75 | 1935.09 | 93.83 | 1.39 | 6.2 |
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