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Journal: Metals, 2025
Volume: 15
Number: 75

Article: Study on the Electromigration Organization and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints
Authors: by Yuming Wang, Keke Zhang, Chao Zhang, Fupeng Huo and Yijie Gao
Link: https://www.mdpi.com/2075-4701/15/1/75

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