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Journal: Metals, 2024
Volume: 14
Number: 986

Article: The Effect of Multiple Solder Reflows on the Formation of Cu6Sn5 Intermetallics and the Decomposition of SnAg3.0Cu0.5 Solder Joints in the Framework of Rework and Reuse of MLCC Components
Authors: by Erik Wiss and Steffen Wiese
Link: https://www.mdpi.com/2075-4701/14/9/986

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