Lithography-Based Metal Manufacturing of Copper: Influence of Exposure Parameters on Green Part Strength

Copper’s high thermal and electrical conductivity enables its application in heat exchangers and high-frequency components. For those applications, additive manufacturing has advantages with respect to functional integration, miniaturization, and reduced waste. However, the processing of copper is a challenge for established laser-based processes since copper’s high reflectivity impedes energy input. Sinter-based additive manufacturing processes do not exhibit this limitation since the energy for the fusion of material is applied by thermal energy during sintering. This makes them an ideal candidate for copper manufacturing. In the following work, Lithography-based Metal Manufacturing (LMM) of copper is demonstrated. Curing behavior is investigated by single-layer exposure (SLE) tests measuring curing thickness for different loading factors, particle sizes, and exposure times. Bending strength is investigated as a function of exposure time, loading factor, and orientation in the building space. A higher exposure time and lower loading factors increase bending strength. Furthermore, samples with different loading factors are produced to measure the impact of the loading factor on sintered density. For these parameters, no clear trend is demonstrated.