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Journal: MetalsVolume: 13Number: 1029
Article: Investigation on Interface of CuW/Al Composite Using Ni Interlayer by Vacuum Hot-Pressing Diffusion Bonding
  • Authors:
  • Chan Wang1,
  • Jian Chen1,* and
  • Wenting Shao1
  • et al.
Link: https://www.mdpi.com/2075-4701/13/6/1029

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