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Journal: MetalsVolume: 13Number: 710
Article: Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder
  • Authors:
  • Tzu-Yang Chiang1,
  • Yong-Chi Chang1 and
  • Chao-Hong Wang2
  • et al.
Link: https://www.mdpi.com/2075-4701/13/4/710

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